Discover our automotive-grade Telematics Control Units (TCU), intelligent BMS controllers, high-voltage vehicle IoT gateways, and commercial fleet mobility platforms engineered for demanding operational environments.
As global e-mobility transitions from legacy internal combustion engines (ICE) to software-defined electric vehicles (EVs), the mandate for telematics hardware has fundamentally evolved. Modern telematics control units (TCUs or T-Boxes) are no longer isolated GPS tracking dongles. They serve as the central neural gateway connecting high-voltage Battery Management Systems (BMS), Traction Inverters, Motor Control Units (MCU), Advanced Driver Assistance Systems (ADAS), and cloud computing infrastructures.
In high-voltage EV architectures (spanning 400V to 800V platforms as well as 60V/72V commercial light electric vehicles), vehicle telematics must handle multi-channel CAN-FD (Controller Area Network Flexible Data-Rate) buses, process complex diagnostic protocols (UDS ISO 14229, SAE J1939), execute real-time edge computing for state-of-health (SOH) battery analytics, and maintain uncompromised cybersecurity under ISO 21434 and UNECE R155/R156 standards.
We provide automotive OEMs, tier-1 suppliers, and commercial fleet integrators with full-stack hardware hardware development, embedded firmware customized to proprietary CAN matrixes, and secure cloud API telemetry protocols.
Our OEM telematics modules feature multi-bus architecture supporting CAN 2.0B, CAN-FD, LIN, and K-Line. Capable of communicating directly with high-voltage traction batteries and smart BMS units to decode cell voltage differentials, state-of-charge (SOC), thermal runaway indicators, and isolation resistance telemetry in real-time.
Security is built into the hardware layer. Our units incorporate hardware security modules (HSM), secure boot features, elliptic-curve cryptography (ECC), and AES-256 encrypted storage. Full alignment with UNECE R155 cybersecurity and UNECE R156 software update management regulations guarantees global market compliance.
Integrated multi-constellation GNSS (GPS, GLONASS, Galileo, BeiDou) coupled with 6-axis Inertial Measurement Units (IMU) and automotive Dead Reckoning (DR) algorithms. Ensures unbroken, centimeter-accurate vehicle positioning even inside urban canyons, parking structures, and subterranean mining sites.
Designed on automotive-grade NXP, STMicroelectronics, or Qualcomm platforms running Linux or FreeRTOS. Local edge algorithms filter micro-vibrations, compute battery wear patterns, detect collisions via g-force trigger, and buffer payload telemetry during network blackouts without losing data.
| Specification Feature | Commercial Fleet T-Box (Linux) | High-Voltage EV Gateway (RTOS) | Off-Road & Micro-Mobility TCU |
|---|---|---|---|
| Core Application Processor | ARM Cortex-A7 Dual-Core @ 1.2GHz | ARM Cortex-M7 Automotive MCU | ARM Cortex-M4 High-Efficiency MCU |
| CAN Bus Interfaces | 3x CAN-FD, 1x Single Wire CAN | 2x CAN 2.0B + High-Voltage Isolation | 1x CAN 2.0B, 1x RS-485 / Modbus |
| Cellular & Connectivity | 4G LTE Cat-4 / 5G Sub-6 + Wi-Fi 5 | 4G LTE Cat-M1 / NB-IoT + Bluetooth 5.2 | LTE-M / NB-IoT / BLE Mesh |
| Diagnostics & Protocols | UDS (ISO 14229), SAE J1939, OBD-II | ISO 15118 (EV Charging), ISO 11898 | Custom Proprietary CAN Matrix |
| Ingress & Environmental | IP67 / IP69K (MIL-STD-810G Vibration) | IP68 Waterproof Sealed Die-Cast Enclosure | IP67 Compact ABS Thermal Housing |
| Security Hardware | Hardware Security Module (HSM) EAL5+ | Crypto Controller & TrustZone | Secure Key Storage Element |
| Firmware Updates | Differential FOTA (Fail-Safe Dual Bank) | FOTA with Secure Flash Recovery | OTA via Bluetooth / Cellular Gateway |
Global vehicle manufacturers are standardizing on hardware-agnostic Telematics Units. Automotive buyers require suppliers to deliver middleware (such as AUTOSAR Adaptive or Classic) that decouples hardware abstraction from cloud fleet software, enabling over-the-air deployment of third-party applications throughout the vehicle's lifecycle.
With tightening EU Battery Passport mandates and stringent safety standards globally, procurement departments now specify TCUs capable of high-frequency sampling (100Hz+) of individual battery cell voltages and thermistors. Predictive AI models executing on the telematics edge detect dendrite growth and isolation breakdowns prior to catastrophic thermal events.
Modern EV telematics units must bridge the vehicle’s internal CAN networks with external EVSE (Electric Vehicle Supply Equipment). By implementing ISO 15118 Plug & Charge protocols, telematics hardware facilitates automated billing, bi-directional V2G (Vehicle-to-Grid) power routing, and grid balancing data streams directly through the onboard gateway.
As a primary custom OEM/ODM manufacturer for globally distributed electric vehicle brands, our state-of-the-art facilities adhere to automotive-grade quality controls certified under IATF 16949:2016 and ISO 9001.
High-speed Fuji SMT surface-mount lines capable of 0201 component placement, 3D SPI (Solder Paste Inspection), and automated 3D AOI quality tracking.
In-house thermal shock chambers (-40°C to +125°C), salt spray corrosion cabinets, 3-axis vibration tables, and high-pressure IP69K water jet testing booths.
Laser-etched QR code component traceability linking every chip, PCB layer, firmware build, and end-of-line test output directly to cloud MES databases.
In-depth answers to common questions regarding customization, CAN matrix parsing, certifications, and volume production support.
We accept customer-provided DBC or ARXML database files under strict Non-Disclosure Agreements (NDA). Our firmware team integrates your custom CAN matrix into our automotive SDK, allowing your Telematics Box to decode proprietary signals (such as specific cell voltages, inverter status flags, and motor torque commands) without altering existing vehicle ECU wiring.
Our standard OEM telematics platforms are certified or engineered for full compliance with CE, FCC, E-Mark (E13/E8 automotive approval), RoHS, REACH, and PTCRB/AT&T cellular carrier approvals. For custom ODM hardware projects, we manage the full certification testing process on behalf of your brand.
Our hardware architecture utilizes dual-bank flash memory with an A/B partition scheme. During a FOTA update, the new firmware payload is downloaded to the passive bank while the active bank continues vehicle operations. The image is cryptographically verified via RSA/ECC signatures before swap. If a power failure occurs mid-transmission, the unit automatically rolls back to the known stable firmware partition within milliseconds.
Yes. We utilize automotive Grade 2 and Grade 1 silicon components rated for operational temperature ranges from -40°C to +85°C (with internal industrial components tested up to +105°C). Enclosures are sealed against dust and immersion up to IP67, IP68, and IP69K standards, making them suitable for chassis mounting on heavy-duty commercial equipment and off-road utility vehicles.
For standard production hardware with custom firmware configuration, our MOQ starts at 500 units. For complete white-label custom PCB design, mold tooling, and casing enclosure developments, initial engineering samples are delivered within 8 to 12 weeks, followed by mass production ramp-up. We maintain strategic buffer stock of critical automotive ICs to protect against global supply chain delays.
Partner with a trusted IATF 16949 certified manufacturing partner. Contact our engineering and procurement team for custom hardware quotes, technical schematics, and evaluation sample units.
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